PNY

FT77-B7015

FEATURES

4U DUAL-SOCKET SMP SERVER IMPLEMENTATION FOR GPGPU APPLICATIONS
- Dual LGA1366 sockets support up to (2) Intel® Xeon® processors 5500/5600 series (codenamed Nehalem-EP/Westmere-EP)
- Support QPI 6.4/ 5.86/ 4.8 GT/s
- Dual Intel® 5520 IOH
- Intel® ICH10R South Bridge
- (18) 240-pin DDR3 DIMM slots support up to 144GB R-DDR3 1333/1066/800MHz w/ECC memory
- Basic SKU (B7015F77V4R):
- (8) FH/FL PCI-E Gen.2 x16 slots supporting up to (8) double-deck GPU adapters
- (2) FH/FL PCI-E Gen.2 x16 slots (w/ x4 link)
- (2) FH/FL PCI-E Gen.2 x1 slots
- (1) FH/FL PCI 32/33MHz slot
- M2090 bundled SKU (B7015F77V4R-N429 / B7015F77V4R-N629 / B7015F77V4R-N829)
- (4/6/8) nVIDIA® Tesla M2090 double-deck GPU adapters
- (4) GbE LAN
- (4) Internal 2.5" SATA HDDs w/ RAID 0, 1, 10, 5 support by Intel® Matrix Storage Technology
- Onboard BMC w/ IPMI and iKVM support
- (2+1) Redundant, ERP1U high-efficiency 2,400W PSU (@220V) w/ PFC, 80-PLUS Silver Certified

SYSTEM
FORM FACTOR: 4U Rackmount
GROSS WEIGHT: 29 kg
CHASSIS MODEL: FT77
DIMENSION (D x W x H):770 x 438 x 176mm
MOTHERBOARD: S7015
BOARD DIMENSION: 406.4x482.6mm

FRONT PANEL
BUTTONS:(1) RST / (1) NMI / (1) ID / (1) PWR w/ LED
LEDs: (1) PWR / (1) HDD / (1) Warning
I/O PORTS:(2) USB ports

INTERNAL DRIVE BAY
TYPE / QUANTITY: 2.5" fixed / (4)
SUPPORTED HDD INTERFACE: SATA-II 3.0Gb/s

SYSTEM COOLING CONFIGURATION
FAN: (3+3) 12cm redundant fans

POWER SUPPLY
TYPE: ERP1U
EFFICIENCY: PFC
SERVICEABILITY: Hot-swap
INPUT RANGE: 100-127V AC (Low-Line Voltage) / 200-240V AC (High-Line Voltage)
FREQUENCY: 60 Hertz
OUTPUT WATTS: 2400W [(2+1) 2400W @200-240V], Max. 12Vdc@ 199.6A / 3000W [3 x1000W @100-127V], Max. 12Vdc@ 249.6A; Note: Only one AC inlet allowed per circuit breaker
GPU POWER CONNECTORS: (8) 2x4-pin & (8) 2x3-pin auxiliary 12V power cables included

PROCESSOR
SUPPORTED CPU SERIES: Intel Xeon Processor 5500/ 5600 Series
SOCKET TYPE / QUANTITY: LGA1366 / (2)
THERMAL DESIGN POWER (TDP) WATTAGE: Max up to 130W
SYSTEM BUS: Up to 4.8/ 5.86/ 6.4GT/s with Intel QuickPath Interconnect (QPI) support
CHIPSET: IOH / ICH Intel (2) 5520 / ICH10R
SUPER I/O: Winbond W83627
PCI-E SWITCH: PLX PEX8647

MEMORY
SUPPORTED DIMM QTY: (9)+(9) DIMM slots
DIMM TYPE / SPEED: DDR3/DDR3L 800/1066/1333* RDIMM/UDIMM
CAPACITY: Up to 144GB at launch w/ dual rank RDIMMs
MEMORY CHANNEL: 3 Channels per CPU
MEMORY VOLTAGE: 1.5V or 1.35V

EXPANSION SLOTS
PCI-E (2) PCI-E x16 slots (w/ x4 link) / (8) PCI-E Gen.2 x16 slots / (2) PCI-E Gen.2 x1 slots
PCI: (1) PCI 32-bit slot
MAX. HBA DIMENSION (H x L): (13) 111.15mm x 312.00mm (FH/FL)

LAN
PORT Q'TY: (4)
CONTROLLER: Intel 82574L

GRAPHIC
CONNECTOR TYPE: D-Sub 15-pin
RESOLUTION: Up to 1600x1200
CHIPSET: Aspeed AST2050

I/O PORTS
USB: (2) ports
VGA: (1) D-Sub 15-pin port
RJ-45: (4) ports

SYSTEM MONITORING
CHIPSET: Winbond W83793G
VOLTAGE: Monitors voltage for CPU, memory, chipset & power supply
TEMPERATURE: Monitors temperature for CPU & system environment
LED: Fan fail LED indicator / Over temperature warning indicator
OTHERS: Watchdog timer support
SERVER MANAGEMENT: Onboard Chipset Onboard Aspeed AST2050
AST2050 IPMI FEATURE: IPMI 2.0 compliant baseboard management controller (BMC) / USB 2.0 virtual hub / BIOS update
AST2050 iKVM FEATURE: 24-bit high quality video compression / Dual 10/100 Mb/s MAC interfaces

BIOS
BRAND/ ROM SIZE: AMI / 4MB
FEATURE: Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring
OPERATING SYSTEM: OS supported list Please refer to our OS supported list.
REGULATION: FCC (DoC) Class A
CE (DoC): Yes

OPERATING ENVIRONMENT
OPERATING TEMP.: 10° C ~ 35° C (50° F~ 95° F)
NON-OPERATING TEMP.: - 40° C ~ 70° C (-40° F ~ 158° F)
IN/NON-OPERATING HUMIDITY: 90%, non-condensing at 35° C

ROHS
ROHS 6/6 COMPLIANT: Yes

PACKAGE CONTAINS
BAREBONE: (1) FT77B7015 Barebone
MANUAL: (1) User's manual
INSTALLATION CD: (1) TYAN installation CD